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RDL First FoWLP’s Underfill process: Dispensing machine for semiconductor integrated circuits

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June 20, 2024
Category Connection: Adhesive Dispensing Machine
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The SS101 is a kind of high-stability and high-precision dispensing system with automatic wafer loading & unloading function which is developed based on Underfill process requirements of RDL First FoWLP, and is mainly used for advanced processes such as CoWoS and FoPoP. (The SS101 consists of one PC101EFEM handing system and two GS600SW wafer-level dispensing machines.
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#glue dispensing machine #automatic glue dispensing machine #automatic glue dispenser
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