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Underfill process for semiconductor packaging dispensing machines for FCBGA, FCCSP and SiP dispenser

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November 21, 2024
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GS600SU Underfill Dispensing Machine
For Die Form Underfill
GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP.

The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.


■ Application Fields
FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application
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