Discrete devices

GS600SU Underfill Dispensing Machine for Die Form Underfi ll   GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.   ■ Application Fields FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application   ■ Technical Specifications Application Fields FCBGA, FCCSP, SIP Applicable Process Die Form Underfill Cleanliness Level Cleanliness of working area Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop)         Transmission Mechanism Transmission system X/Y:Linear motor Z: Servo motor&Screw module Repeatability (3sigma) X/Y: ±0.003mm, Z: ±0.005mm Positioning accuracy (3sigma) X/Y: ±0.010mm, Z: ±0.015mm Max. movement speed X/Y: 1000mm/s Z: 500mm/s Max. accelerated velocity X/Y: 1g, Z: 0.5g Grating resolution 1 μ m Z axis movement range(W× D) 3 5 0 mm×4 7 0mm Z axis height calibration & compensation Method Laser sensor (Laser sensor) Laser sensor accuracy 2μ m           Dispensing System Glue control accuracy ± 3 % / 1mg Single dot position repeatability CPK＞1.0 ±25 μ m Min. nozzle diameter 30 μ m Min. single dot glue weight 0 .001mg/dot Max. fluid viscosity 200000cps Max. jetting frequency 1000Hz Runner/nozzle heating temperature Room temperature~200℃ Runner/nozzle heating temp. deviation ± 2 ℃ Applicable adhesive packaging spec. 5CC/10CC/30CC/50CC/70CC Syringe cooling range Cools down to 15°C below ambient temp. Piezo cooling range Cools down to compressed air source temp.             Track System Number of tracks 2 Number of belt sections One piece Max. track transmission speed 300mm/s Max. track transmission weight 3kg Minimum edge clearance 3 mm Track width adjustment range 60mm~ 162mm Adjustable Track width adjustment Method Manual Track height 910mm~960mm Adjustable Max. thickness of applicable substrate/carrier 6 mm Applicable substrate/carrier length range 60mm-325mm Vacuum suction pressure Range -50~-80Kpa Adjustable Bottom heating temperature range Room temperature~180℃ Bottom heating temp. deviation ≤ ± 1 . 5 ℃       Facilities Footpri nt W× D× H 2380mm*1550mm*2080mm(Loading&Unloading& display included) 2380mm*1200mm*2080mm(Loading&Unloading included, display excluded) Weight 1600kg Power supply 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply) Electric current 30A Power 6.4KW Inhale (0.5Mpa, 450L/min) ×2   FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application Special Process Modules CUF Special Piezoelectric Jetting System Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence Triple Low-level Alarm Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue Vacuum Adsorption Heating Fixture The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation Press-Down Track The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture. Platform-Type Loading & Unloading System The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit Friendly human-machine interface design Visual system Positioning and detection functions Inspection before operation to avoid defective incoming materials Inspection after operation to prevent batch defects    

GS600M Online Visual Dispensing Machine GS600M is a fully- automatic online dispensing platform developed based on the needs of the MEMS industry. It can provide one- stop solutions for on- line ASIC chip encapsulation, precision solder paste dispensing and multiple fool- proof detection, etc. in the MEMS process. High- quality control of the entire production process is realized.The on-line workstation operation can also be selected. Features and AdvantagesOn-line ModeYield ImprovementWork positions are inspected before and after operation, and the fi nal station is professionally inspected to achieve multiple fool proof.Full AutomationThe on- line mode is used to minimize manual intervention.Prevention of Whole Line DowntimeOperation tracks / conveyor tracks are separated, so that shutdown of a single machine does not affect the operation of the whole line. Application FieldsMEMS Microphone MEMS accelerometer MEMS Barometer Technical SpecificationsModel GS600MApplication FieldsDie form packaging of lead frame, substrate, shellApplicable ProcessChip Encapsulation,Solder paste gluing ,Potting ,component reinforcementCleanliness LevelCleanliness of working areaClass 100 (Class 1000 workshop) Class 10 (Class 100 workshop)TransmissionSystemTransmission mechanismsX/Y:Linear motorZ:Servo motor&Screw moduleRepeatability (3sigma)X/Y: ±0.010mm Z: ±0.015mmPositioning accuracy (3sigma)X/Y: ±0.015mm Z: ±0.025mmMax. movement speedX/Y :1000mm/s Z: 500mm/sMax. accelerated velocityX/Y: 1g Z: 0.5gGrating resolution1 μ mZ axis height calibration&compensation MethodLaser sensor (Laser sensor)Laser sensor accuracy±0.01mmDispensingCapabilityDispensing methodPiezo-pump (Mingseal self-developed)Glue control accuracy±3%/1mg(as per actual adhesive specific gravity)Min. single dot glue weight0.001mg/dot(as per actual adhesive specific gravity)Max. fluid viscosity200000cpsMax. jetting frequency1000HzRunner/nozzle heating temperatureRoom temperature~200℃Runner/nozzle heating temp. deviation±2℃FacilitiesFootprint W× D × H2050× 1535×2085mmWeight1.5tPower supply200~240VAC,47~63HZ(Single-phase voltage adaptation power supply)Electric current35APower7KWInhale5.0-7.0 kg/cm2  

GS600DD Fully- Automatic Dispensing Machine   For Dam & Fill GS600DD fully-automatic dispensing machine is a piece of high-stability and high-precision dispensing equipment which is developed based on Dam & Fill process requirements of FCBGA,etc.The equipment meets the needs of the semiconductor industry,is provided with an automatic loading & unloading system, and can automatically realize functions of magazine loading & unloading , dam glue-jetting and underfill glue-jetting. It is compatible with international semi- conductor communication protocols , and matches the information management requirements and unmanned management trends.   System Composition GS600DD fully- automatic dispensing machine × 1 Magazine automatic loading & unloading machine × 1   Operation Flow Magazine loading -Dam glue-jetting-Underfill glue-jetting-Magazine unloading   Features and Advantage Good shock absorption with mineral frame structure to effectively reduce the impact caused by high-speed equipment operation. Capacitive detection and laser induction detection to avoid product loss caused by insufficient glue amount Dustproof level 10, meeting the packaging environment requirements. Automatic dispensing position compensation function to ensure the dispensing accuracy ESD protection meeting international IEC and ANSI standards. Glue width detection function to avoid process risks caused by poor dispensing. Technical Specifications   Model GS600DD System Composition GS600DD * 1,Magazine automatic loading & unloading machine * 1 Application Fields FCBGA,Wire Bonding Encapsulation Cleanliness Level Cleanliness of working area Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop) Transmission System Dimensions 770×1650×2100mm Transmission system X/Y:Linear motor Z:Servo motor&Screw module Repeatability (3sigma) X/Y: ±5 μm Z: ±10 μm Positioning accuracy (3sigma) X/Y: ±10 μm Z: ±25 μm Max. movement speed X/Y:1300mm/s Z: 500mm/s Max. accelerated velocity X/Y:1.3g Z:0.5g Dispensing range 355mm×595mm Grating resolution 1 μ m Visual repetitive matching accuracy 5μ m Adhesive single-point position accuracy ≤±30 μ m Z axis height calibration & compensation method Laser sensor Laser sensor accuracy ±1 μ m Z axis spec. Asynchronous Double-head Applicable syringe type 5cc, 10cc,30cc,50cc,70cc Glue weight accuracy 10mg±3%,5mg±5% Weighing module accuracy 220g/0.1mg Vision Module Pixel 500W (2048×2448dpi) Lens 0.2X telecentric lens Camera view 35×35mm Single pixel accuracy 17um Glue width detection ≥ 170um AOI FRR (misjudgment rate) ＜2.5% AOI FAR (missing detection rate) 0 Visual positioning method Mark/Product appearance features Angle correction capability of the secondary valve relative to the main valve 0-180° (7 ×7mmWorkpiece) 0-3° (110×110mmWorkpiece) Shooting method Positioning shot/fly shot Facilities Ambient temp. & humidity 25℃±5℃ , 30 ~ 70% Footprint W× D × H 770×1650×2100mm (w/o Loading & Unloading)