Integrated circuit

SS101 Wafer-Level Dispensing Machine   For Wafer Form Underfill SS101 is a highly stable and precise wafer level dispensing system which is developed based on Under fill process requirements of RDL First WLP. The equipment meets the needs of the semiconductor industry,can be provided with an automatic wafer loading & unloading system , and can automatically realize functions such as wafer handling , alignment , preheating , operation heating and heat dissipation . It is compatible with international semiconductor communication protocols , and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends.   SS101 System Layout   ➀ Loadport & Foup ➁ Aligner ➂ QR code scanning station ➃ Pre-heating station ➄Heat dissipation station ➅GS600SWA Dispensing Machine work station ➆GS600SWB Dispensing Machine work station ➇Robot Handling module     Composition of SS101 Wafer-Level Dispensing System GS600SW wafer-level dispensing machine × 2 PC101 wafer loading & unloading machine × 1 Application Fields RDL First WLP CUF Application SS101 Wafer-Level Dispensing Operation Flow Features and Advantages Supporting 8/12-inch wafer dispensing. Dustproof level 10, meeting the environmental requirements of wafer level packaging. ESD protection meeting international IEC and ANSI standards. In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety. The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis   Technical Specifications   SS101 system GS600SWA * 1 ,GS600SWB * 1, PC101 Wafer Handling Machine * 1 (EFEM) Application Fields RDL First WLP, CUFApplication Cleanliness Level Cleanliness of working area Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop)     Product Application Fields Support for wafer size φ200mm±0 .5mm, φ300mm±0.5mm (Standard model supports 12-inch wafers only) Support for wafer thickness 300-2550μ m Allowable wafer max. warpage range ＜5mm (as per Robot Finger type) Allowable max.wafer weight 600g (as per Robot Finger type) Wafer cassette form 8 inches Open Cassette,12 inches Foup (Standard model supports 12-inch wafers only)     PC101(EFEM) Loading&unloading method Loadport+Robots Pre-Aligner accuracy Round center correction deviation≤±0 . 1mm； Angle correction deviation≤±0 .2 ° Wafer reader Supports SEMI fonts (Flat or concave/convex surfaces) ,non-SEMI fonts Preheating temp. range Room temperature~180℃ Wafer cooling method Natural cooling or air cooling     Dispensing Motion System Transmission mechanisms X/Y: Linear motor Z: Servo motor&Screw module Repeatability X/Y: ±3μ mZ: ±5μ m Positioning accuracy X/Y: ±10μ m Max. movement speed X/Y: 1000mm/s Z: 500mm/s Max. accelerated velocity X/Y: 1g Z: 0 .5g   Vision System Camera pixels 130W Recognition accuracy ±1 Pixel Recognition range 12 × 16mm＜Recognition range＜19 .2 ×25 .6mm Light source Combined three-color light source red, green, white + red Weighing Calibration System Weighing accuracy 0.01mg     Chuck Table Load Tray Vacuum surface flatness deviation ≤ 3 0 um Heating temp.range Room temperature~180℃ Heating temp. deviation ≤ ± 1 . 5 ℃ Repeatability of lifting height ±10 μ m Vacuum suction pressure -70~-85Kpa Settable           Facilities Footprint (W*D*H) 3075×2200×2200mm(Display unfolded) Weight 2.9t Power supply 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply) Electric current 75A Power 16.5KW Inhale (0.5Mpa, 450L/min) ×5 way Operating ambient temp. 23℃±3℃ Relative humidity of working environment 30 ~ 70%    

GS600DD Fully- Automatic Dispensing Machine   For Dam & Fill GS600DD fully-automatic dispensing machine is a piece of high-stability and high-precision dispensing equipment which is developed based on Dam & Fill process requirements of FCBGA,etc.The equipment meets the needs of the semiconductor industry,is provided with an automatic loading & unloading system, and can automatically realize functions of magazine loading & unloading , dam glue-jetting and underfill glue-jetting. It is compatible with international semi- conductor communication protocols , and matches the information management requirements and unmanned management trends.   System Composition GS600DD fully- automatic dispensing machine × 1 Magazine automatic loading & unloading machine × 1   Operation Flow Magazine loading -Dam glue-jetting-Underfill glue-jetting-Magazine unloading   Features and Advantage Good shock absorption with mineral frame structure to effectively reduce the impact caused by high-speed equipment operation. Capacitive detection and laser induction detection to avoid product loss caused by insufficient glue amount Dustproof level 10, meeting the packaging environment requirements. Automatic dispensing position compensation function to ensure the dispensing accuracy ESD protection meeting international IEC and ANSI standards. Glue width detection function to avoid process risks caused by poor dispensing. Technical Specifications   Model GS600DD System Composition GS600DD * 1,Magazine automatic loading & unloading machine * 1 Application Fields FCBGA,Wire Bonding Encapsulation Cleanliness Level Cleanliness of working area Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop) Transmission System Dimensions 770×1650×2100mm Transmission system X/Y:Linear motor Z:Servo motor&Screw module Repeatability (3sigma) X/Y: ±5 μm Z: ±10 μm Positioning accuracy (3sigma) X/Y: ±10 μm Z: ±25 μm Max. movement speed X/Y:1300mm/s Z: 500mm/s Max. accelerated velocity X/Y:1.3g Z:0.5g Dispensing range 355mm×595mm Grating resolution 1 μ m Visual repetitive matching accuracy 5μ m Adhesive single-point position accuracy ≤±30 μ m Z axis height calibration & compensation method Laser sensor Laser sensor accuracy ±1 μ m Z axis spec. Asynchronous Double-head Applicable syringe type 5cc, 10cc,30cc,50cc,70cc Glue weight accuracy 10mg±3%,5mg±5% Weighing module accuracy 220g/0.1mg Vision Module Pixel 500W (2048×2448dpi) Lens 0.2X telecentric lens Camera view 35×35mm Single pixel accuracy 17um Glue width detection ≥ 170um AOI FRR (misjudgment rate) ＜2.5% AOI FAR (missing detection rate) 0 Visual positioning method Mark/Product appearance features Angle correction capability of the secondary valve relative to the main valve 0-180° (7 ×7mmWorkpiece) 0-3° (110×110mmWorkpiece) Shooting method Positioning shot/fly shot Facilities Ambient temp. & humidity 25℃±5℃ , 30 ~ 70% Footprint W× D × H 770×1650×2100mm (w/o Loading & Unloading)    

GS600SU Underfill Dispensing Machine for Die Form Underfi ll   GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.   ■ Application Fields FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application   ■ Technical Specifications Application Fields FCBGA, FCCSP, SIP Applicable Process Die Form Underfill Cleanliness Level Cleanliness of working area Class 100 (Class 1000 workshop) Class 10 (Class 100 workshop)         Transmission Mechanism Transmission system X/Y:Linear motor Z: Servo motor&Screw module Repeatability (3sigma) X/Y: ±0.003mm, Z: ±0.005mm Positioning accuracy (3sigma) X/Y: ±0.010mm, Z: ±0.015mm Max. movement speed X/Y: 1000mm/s Z: 500mm/s Max. accelerated velocity X/Y: 1g, Z: 0.5g Grating resolution 1 μ m Z axis movement range(W× D) 3 5 0 mm×4 7 0mm Z axis height calibration & compensation Method Laser sensor (Laser sensor) Laser sensor accuracy 2μ m           Dispensing System Glue control accuracy ± 3 % / 1mg Single dot position repeatability CPK＞1.0 ±25 μ m Min. nozzle diameter 30 μ m Min. single dot glue weight 0 .001mg/dot Max. fluid viscosity 200000cps Max. jetting frequency 1000Hz Runner/nozzle heating temperature Room temperature~200℃ Runner/nozzle heating temp. deviation ± 2 ℃ Applicable adhesive packaging spec. 5CC/10CC/30CC/50CC/70CC Syringe cooling range Cools down to 15°C below ambient temp. Piezo cooling range Cools down to compressed air source temp.             Track System Number of tracks 2 Number of belt sections One piece Max. track transmission speed 300mm/s Max. track transmission weight 3kg Minimum edge clearance 3 mm Track width adjustment range 60mm~ 162mm Adjustable Track width adjustment Method Manual Track height 910mm~960mm Adjustable Max. thickness of applicable substrate/carrier 6 mm Applicable substrate/carrier length range 60mm-325mm Vacuum suction pressure Range -50~-80Kpa Adjustable Bottom heating temperature range Room temperature~180℃ Bottom heating temp. deviation ≤ ± 1 . 5 ℃       Facilities Footpri nt W× D× H 2380mm*1550mm*2080mm(Loading&Unloading& display included) 2380mm*1200mm*2080mm(Loading&Unloading included, display excluded) Weight 1600kg Power supply 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply) Electric current 30A Power 6.4KW Inhale (0.5Mpa, 450L/min) ×2   FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application Special Process Modules CUF Special Piezoelectric Jetting System Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence Triple Low-level Alarm Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue Vacuum Adsorption Heating Fixture The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation Press-Down Track The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture. Platform-Type Loading & Unloading System The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit Friendly human-machine interface design Visual system Positioning and detection functions Inspection before operation to avoid defective incoming materials Inspection after operation to prevent batch defects    

SS200 Lid Attachment System   It’s a highly stable and precise lid attachment system developed based on Lid Attach process requirements of FCBGA/FCCSP. Integrating the functions of automatic loading & unloading, dispensing, Lid Attach, Snapcure, and dispensing & attachment inspection, the system can automatically realize functions including automatic loading & unloading of substrates and lids, automatic AD & Tim glue coating, glue shape detection, lid attachment and attachment result detection, and lid pressure-holding and pre-curing. It is compatible with international semiconductor communication protocols , and meets the relevant requirements of automated production lines .   Composition of Fully-Automatic Operation System   ❶ KLM201 loading machine ❷ GS600SD dispensing machine ❸ AS1 0 0 mounting machine ❹ MP200 hot pressing machine ❺ KUM2 0 1 unloading machine * The machines of this system are of modular design. * The sequence or quantity of the dispensing machine, mounting machine and hot pressing machine can be adjusted according to the requirements of process sequence and effic ie ncy ratio .   Features and Advantages Good shock absorption with mineral frame structure to effectively reduce the impact caused by high-speed operation. ESD protection meeting international IEC & ANSI standards. Automatic dispensing position compensation function to ensure the dispensing accuracy. Modular design of the whole machine, and dispensing operation supporting double valve synchronization with interpolation/double- valve asynchronization. Dustproof level 10 , meeting the requirements of advanced packaging industry. Glue width detection function to avoid process risks caused by poor dispensing. Corresponding inspection function to ensure product quality after completion of each process stage. Platform-type loading system to support continuous operation of multiple magazine.   SS200 Application Fields Application Fields FCBGA / FCCSP Lid Attach Application ( including AD glue, Tim glue , Lid Attach ,Snapcure) Suitable PKG Size 5 mm× 5 mm- 110 mm× 110mm M ax . Boat S iz e L× W≤ 325 mm× 162mm M ax . Boat W e ight 3kg ( product weight included) Max . Magazine Size L× W× H≤ 330 mm× 165 mm× 180mm M ax . Lid Tray Siz e L× W≤ 3 1 6 mm× 135mm Lid loadi ng Method Magazine, Tray loading (Standard)； belt type feeding( optional) ； Tube/ soft Tray ( customizable)   SS200 Public Facilities Ambient Temp . & Hum idity 25℃±5℃ , 30 ~ 70% Footprint W× D× H 5870 mm× 1650 mm× 2100mm System Weight 5.8T Power Supply 200~240VAC,47~63HZ ,Single phase voltage adaptive power supply Electric Current 81A Power 18KW Inhale 1770L/Min   KLM/KUM201 Loading & Unloading Module KLM/ KUM201Loader & Un loader Size 1 2 0 0 mm× 6 1 5 mm× 2 0 14mm FM Clean and Quarantine Ion air curtain shower at entrance Boat Q ty . 3 pcs Loading Manner Platform type Repeatability ( 3 sigma) Z/Y: ＜0.05mm Max . Movement Speed Z/Y: 300mm/s Max . Accelerated Velocity Z/Y: 3000mm/s²     Product Protection 1.In normal working state/temporary power failure of the machine, the motion axis remains in place to prevent the product from falling 2. Equipped with different color lights visualizing the status of the tray 3. Able to detect tray protruding out of boat and then stop and alarm 4. Able to detect and alarm for material jamming 5. Able to detect and alarm for abnormal operating position of the tray