On February 21, 2025, SEMICON KOREA 2025 (Seoul Semiconductor Industry Technology Exhibition) hosted by SEMI, the International Semiconductor Manufacturing Equipment and Materials Association, concluded successfully at the COEX Seoul Convention Center in South Korea.

 

This exhibition can be called an annual event in the semiconductor field. It brings together leading companies and authoritative experts from various industries such as semiconductor materials and equipment, chip design and manufacturing processes, intelligent manufacturing, semiconductor packaging, automotive electronics, integrated circuit terminal products, semiconductor optoelectronic devices, semiconductor discrete device products and application technologies. They focus on the cutting-edge trends of the industry, deeply discuss technological innovation and development paths, and contribute wisdom and strength to the advancement of the semiconductor industry.

 

 

 

With the continuous advancement of science and technology, the semiconductor industry has continued to develop keeping pace with the times and has become an important force in promoting economic development. SEMICON KOREA is one of the most influential semiconductor exhibitions in Asia, attracting nearly 800 exhibitors and more than 40,000 professional visitors from all parts of the world.

As a core process equipment provider in the field of semiconductor packaging and precision electronics, Mingseal Technology brought new products and a variety of core products to C642 in Hall 3. With its superb and profound technical strength and rich and diverse industry experience, it has successfully attracted the attention and attention of many overseas customers.

 

 

In integrated circuits field, It can achieve wafer-level package (WLP), panel-level package (PLP), flip-chip ball grid array (FCBGA), flip-

chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray,

Solder Paste Painting and Lid Attach.

 

In Discrete Component field, It can achieve leadframe pachage, substrate package and shell & case package, etc. Including processes such as ship coating, solder paste painting, potting, component reinforced-gluing and underfill.

 

Mingseal Technology provides enterprises with a one-stop solution for the entire life cycle from process evaluation to equipment maintenance. Help enterprises improve efficiency and reduce costs, and stand out in market competition. With innovative technology, reliable products and considerate services, we are firmly at the forefront of the semiconductor dispensing field and continue to empower the development of the industry.

Faced with the semiconductor industry's high requirements for accuracy, speed and stability, Mingseal has overcome the difficulties with its independently developed leading technology. The high-precision fluid control system can achieve micron-level dispensing accuracy and ensure the yield rate of complex processes such as chip packaging. Intelligent visual recognition technology can quickly identify chips, adjust dispensing paths in real time, and reduce manual inspection costs.

 

 

 

FS200A online visual dispensing machine is a multi-head, high-speed, high-precision, cost-effective online dispensing equipment. It can meet dispensing process requirements such as high-precision encapsulation, damming, filling, bonding, and reinforcement under complex working conditions.

 

For the individual needs of different companies, FS200A can also flexibly customize solutions, from point layout, glue output control to motion trajectory planning, to provide companies with precise solutions in an all-round way, helping companies optimize production processes, reduce costs and increase efficiency, and seize market opportunities.

 

 

 

KPS4000 is a high-speed, precise non-contact injection system that exhibits excellent performance advantages and can be adapted to media with low, medium, high or ultra-high viscosity. The design eliminates the nozzle sealing plate and sealing ring, which effectively reduces the cost of consumables for the equipment and simplifies the maintenance process. At the same time, its ADJ correction function has been optimized with a high repetition accuracy of 0.01mm. Even after 20 million frequent drives, it has always maintained a stable and reliable working condition, providing a solid guarantee for high-precision production operations.

 

 

At the same time, KDP0900 & KSP0450 eccentric screw valves（low flow） have also attracted much attention. This series of screw valves are suitable for high-precision distribution of single-component fluids. Whether it is low-viscosity quick-drying glue or medium-high viscosity structural glue, they can achieve perfect distribution. They can effectively reduce glue waste and reduce enterprise production costs. At the same time, the stable and efficient distribution process greatly shortens the production cycle, allowing companies to deliver more high-quality products in a shorter period of time and improve overall production efficiency. Precise fluid control can also reduce the rate of defective products, help companies improve product quality and enhance market competitiveness.

 

 

During the exhibition, Mingseal Technology welcomed customers from all over the world with enthusiasm, conducted in-depth exchanges with them, accurately grasped customer needs, and jointly discussed cooperation intentions. With rich industry knowledge, our professional team not only explained the products and technologies in detail, but also provided intuitive on-site demonstrations to allow customers to truly feel how innovative equipment and solutions can empower production and significantly improve production efficiency and product quality.

 

After the on-site experience, many customers reported that they had a new and profound understanding of Mingseal Technology's products and services, and they all expressed their expectations for broader and deeper cooperation with us in the future. 

 

 

Looking forward to the future, Mingseal Technology will unswervingly adhere to the corporate mission of "achieve more high-end intelligent manufacturing" and make every effort to deliver more high-quality and efficient solutions to the global semiconductor packaging field, helping the industry move to new heights. We will always maintain a keen grasp of market dynamics and a profound insight into technology trends, unswervingly invest in technology research and development, deeply explore product potential, continue to optimize performance, fully meet the rising and diverse needs of customers, and drive industrial upgrading with technological innovation.

 

The excitement continues
at the next stop SEMICON CHINA in March!

see you in Shanghai