Company news about Mingseal Technology appeared at Shenzhen NEPCON ASIA 2024, demonstrating its innovative strength in precision electronic manufacturing!
News Details
Mingseal Technology appeared at Shenzhen NEPCON ASIA 2024, demonstrating its innovative strength in precision electronic manufacturing!
2024-11-08
On November 8, 2024, NEPCON ASIA 2024 (Asian Electronic Production Equipment and Microelectronics Industry Exhibition) concluded successfully at the Shenzhen International Convention and Exhibition Center. This exhibition brought together many people from semiconductor packaging and testing, intelligent manufacturing, automotive electronics, touch display, etc. Top companies and experts in various industries, the scale of the exhibition reached a new high, bringing together more than 60,000 domestic and foreign buyers and industry elites to visit and exchange. As a core process equipment provider in the field of semiconductor packaging and testing and precision electronics, Mingseal Technology made a wonderful appearance in Hall 11 with new products and a variety of dispensing and spraying equipment. With its outstanding technical strength and industry experience, it attracted many domestic and foreign customers. and attention.
At this exhibition, we demonstrated the new FS200A online visual dispensing machine to the world for the first time. This equipment is specially designed for the consumer precision electronics CCM/VCM module industry. It can meet the high-precision dispensing requirements under complex working conditions and greatly improves production efficiency. Many customers have shown strong interest in its application in encapsulation, damming, filling and other processes, and have expressed their desire to learn more about product details and possible cooperation.
The GS600DD double valve dispensing machine has also attracted much attention. This equipment not only has high stability and high precision, but also can support automatic loading and unloading systems, realize Magazine loading and unloading, dam dispensing and filling, which greatly improves the automation level of the production line. Customers appreciate its ability to be compatible with international semiconductor communication protocols and believe that this is crucial for adapting to future information management and unmanned management trends.
The AC100 fully automatic placement machine also attracted great attention from customers at the exhibition with its high stability and high-precision performance advantages. This equipment supports multiple functions such as fully automatic Substrate loading and unloading, dispensing and glue shape detection, component mounting, etc. It can meet the precision assembly and dispensing needs of modules and tube and shell devices. Its powerful functions and flexible configuration make Customers can maintain efficient production capabilities in complex production environments, which greatly enhances the competitive advantage of products.
In addition, our core products have also attracted much attention, including: KDC series precision dispensing controllers, which can achieve precise glue volume control and efficient glue dispensing frequency, and are widely used in semiconductor packaging and testing and micro-dispensing of precision electronics; KPS series The piezoelectric injection valve can realize high-speed, precise and non-contact injection applications of low, medium, high and ultra-high viscosity media. It is widely used in non-contact glue spraying operations of semiconductor packaging and testing and precision electronics. Industry; KSP series eccentric screw valves, efficiently and stably transport various low, medium and high viscosity fluids, achieving high-precision fluid metering; KSV series concentric screw valves, specially used for quantitative transportation of particle-containing media and high-viscosity media, through High wear-resistant materials ensure an ultra-long maintenance cycle; KZSS series quantitative machines and KGL pressure plate pumps realize large flow measurement and feeding, and are widely used in automotive electronics, new energy and other fields.
During the exhibition, Mingseal Technology actively received customers from all over the world and communicated in depth about each other's needs and cooperation intentions. Through professional explanations and on-site demonstrations, our team demonstrated how to use innovative equipment and solutions to improve customers' production efficiency and product quality. Many customers said that through on-site experience, they had a deeper understanding of Mingseal Technology's products and services, and looked forward to more in-depth cooperation with us in the future.
On the last day of the exhibition, Mingseal Technology invited customers and industry partners to share their feedback and expectations. Customers generally recognize our product technology and look forward to Mingseal Technology launching more innovative products that meet market demand in the future. At the same time, they also raised the problems and challenges encountered in practical applications, which provided valuable reference for our subsequent research and development and services.
In the future, Mingseal Technology will continue to adhere to the corporate mission of "achieving more high-end intelligent manufacturing" and is committed to providing more efficient and reliable solutions to the global electronics manufacturing industry. We will continue to pay attention to market dynamics and technology trends, actively carry out technology research and development, and improve product performance to meet the growing needs of customers. At the same time, we will further strengthen communication and cooperation with customers to ensure that we continue to provide customers with high-quality experience in terms of product development, technical support and after-sales service. We look forward to working with more industry partners to jointly create a new chapter in the electronics manufacturing industry!