How Piezo Valves Revolutionized Semiconductor Packaging & Mobile Camera Assembly
Imagine, 40 years ago, engineers used syringes for dispensing glue on electronic components, which was like painting on a stamp with a big brush – slow and error-prone. The dispensing precision at that time was only ±500μm, and 4 out of every 10 products were unqualified. This is unimaginable in today's electronics industry that pursues perfection.
With the development of technology, pneumatic valve dispensing technology emerged in the early 2000s, the precision has been further improved. But a new problem arose: if the glue was a bit thicker, the dispensing volume would be inaccurate. It's like squeezing toothpaste with air pressure – the amount extruded varies with the softness of the toothpaste.
It was not until recent years that piezo valves completely changed the game. Take Mingseal's piezo valve technology as an example. It can achieve ultra-precise dispensing with an accuracy ≤100um! Combined with the AI vision system, it automatically corrects the dispensing position, soaring the yield rate to 99.8%.
In the field of semiconductor packaging, the underfill of below 14nm chips requires the glue to be precisely controlled on glue lines with the tolerance accuracy of ±10μm, and Mingseal's dispensing equipment is perfectly up to the task. In the manufacturing of mobile phone camera modules (CCM) and voice coil motors (VCM), its equipment can achieve a dispensing accuracy of 0.1μL, achieving zero light leakage and making mobile phone photos clearer.
With these leading technologies, Mingseal has captured 90% market share of China-owned brand equipment in advanced semiconductor packaging and 80% in precision dispensing for mobile phone VCM/CCM. If you are looking for high-precision dispensing solutions, whether it's piezo valves, screw valves, or dispensing controllers, Mingseal can provide professional support.
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