Company news about Exhibition Preview | Mingseal Technology has will attend to SEMICON KOREA in South Korea, read the highlights in advance!

 

SEMICON KOREA 2025 is an annual event hosted by SEMI, the International Semiconductor Manufacturing Equipment and Materials Association, and gathers outstanding domestic and foreign semiconductor materials and equipment companies.

EXHIBITION CONTENT

The theme of this year’s exhibition is “Innovation Beyond Boundaries”. With the rapid development of artificial intelligence, technological collaboration and innovation from chip design, chip manufacturing and supply chain will transcend existing boundaries.

The scope of exhibits at the 2025 Seoul Semiconductor Exhibition in South Korea includes:

EQUIPMENT: semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, etc.

SEMICONDUCTOR MATERIALS: silicon wafers, silicon germanium materials, S01 materials, silicon materials for solar cells and compound semiconductor materials, quartz products, graphite products, anti-static materials.

PRODUCTS and TECHNOLOGIES: IC products and application technologies; IC products and technologies, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging; integrated circuit terminal products; semiconductor optoelectronic devices; semiconductor discrete device products and application technologies.

Mingseal Technology's 2.5D packaging, CoWoS, FOWLP, FOPLP and other packaging manufacturing processes are designed to be widely used in many cutting-edge fields such as artificial intelligence (AI), advanced manufacturing processes, heterogeneous integration, and ADAS autonomous driving.

In integrated circuits field, It can achieve wafer-level package (WLP), panel-level package (PLP), flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray, Solder Paste Painting and Lid Attach.

In Discrete Component field, It can achieve leadframe pachage, substrate package and shell & case package, etc. Including processes such as ship coating, solder paste painting, potting, component reinforced-gluing and underfill.

 

HALL:3  BOOTH:C642

 

 

Mingseal Technology will appear at this exhibition with dot/glue solutions for the semiconductor industry, displaying many core products in Hall 3, No. C642. Looking forward to seeing you in Seoul, South Korea!

 

 

PREVIEW OF NEW PRODUCTS

 

FS200A Online Visual Dispensing Machine

FS200A online visual dispensing machine is a multi-head, high-speed, high-precision, cost-effective online dispensing equipment. This equipment integrates a number of core dispensing technologies and is equipped with rich configurations to meet dispensing process requirements such as high-precision encapsulation, damming, filling, bonding, and reinforcement under complex working conditions.

 

KPS4000 Piezoelectric Jetting Valve

KPS4000 is a new generation of high-speed, precise and non-contact jetting system which can deal with low, medium, high and ultra-high viscosity media; configurations such as UV type, corrosion-resistant type and PUR type are available for selection according to different application media.

 

 

PROCESS MODULE

 

KSP0450 Eccentric Screw Valve( Low Flow)

The KSP series is a kind of precision volumetric one-component screw valve, is suitable for applications in which high-precision dispensing ofone-component fluids is required, and can perfectly dispense low, medium and high viscosity adhesives.

 

 

KDP0900 Eccentric Screw Valve( Low Flow)

The KDP series is a kind of precision volumetric two-component screw valve, is suitable for applications in which precise control of two-component mixing ratio is required, and can deal with various types of two-component adhesives.

KSV1000 Concentric Screw Valve

The KSV1000 series is a kind of screw valve for quantitative conveying and dispensing of media containing particles and medium and high viscosity media. The valve body can be provided with screw of different specifications to cover applications with different flow and glue mount requirements. The valve body adopts a quick release design, which is convenient for quick cleaning and maintenance.

 

KSP Series Eccentric Screw Valve

The KSP series is a kind of screw valve which is capable off continuous dispensing and precise dosing. The valve core consists of an eccentric screw engaged with a matching elastic rubber, and the valve body can be provided with valve cores of different flow specifications according to different application scenarios with different flow and glue amount requirements.